Are you looking for flexible photonic system concepts that can address strongly heterogeneous markets based on a uniform technology?
Vanguard’s multi-chip integration platform combines the technological flexibility of discrete systems with the compactness and economic advantages of large-scale photonic integration
Two silicon on insulator (SOI) chips connected via free-form photonic wire bonds (PWB) to form a multi-chip-module [see References 1]. (Picture: N. Lindenmann, KIT)
High-speed communication systems cannot afford compromises – neither in performance, nor in price. Vanguard’s proprietary photonic wirebonding technology allows to merge the specific strengths of different photonic integration platforms in a hybrid multi-chip system. Connecting InP lasers to silicon photonic chips, to low index-contrast planar lightwave circuits (PLC), or to optical fibers is one of our favourite challenges.
You 
think this can be useful in realizing the next generation of photonic engines for 400G Ethernet, data-center interconnects, or optical access networks? We are happy to help you find out!
Connection between a silicon photonic chip and an InP-based horizontal-cavity surface-emitting laser (HCSEL) [see References 3] (Picture: M. R. Billah, KIT)