Photonic multi-chip integration
Let’s face it: There is simply no perfect integration platform for photonic systems! Instead, designers have to deal with a variety of material systems – silicon photonics, indium phosphide, TriPleX™, just to name a few.
Vanguard’s proprietary photonic wirebonding technology can merge the distinct advantages of these platforms by connecting single-mode photonic circuits across waveguide boundaries – without active alignment, and without additional elements for mode field adaptation.
Vanguard’s proprietary photonic wirebonding technology can merge the distinct advantages of these platforms by connecting single-mode photonic circuits across waveguide boundaries – without active alignment, and without additional elements for mode field adaptation.
Multi-chip module enabled by photonic wire bonding (PWB)
Photonic chips and optical fibers are mounted on a common carrier and embedded into a photosensitive photoresist. Photonic wire bonds are then written in the volume of the resist by two-photon polymerization. The wire bonds can have arbitrary three-dimensional shapes. This eliminates active alignment even for nano-scale single-mode waveguides and enables perfect matching of mode field sizes. [Picture see References 1-4]