2nd place for Vanguard Photonics at KIT – Innovation Award NEULAND 2017

June 28, 2017: TogeKIT-Preis-NEULAND 2017ther with its partnering research institute KIT-IPQ, Vanguard Photonics won the 2nd place at the KIT – Innovation Award “NEULAND” for its innovative capabilities of “3D printing of photonic wire bonds on chip level”.

In this prize-category, the initiation of successful cooperation between KIT and an industrial partner are recognized.

The last few years KIT Venture Fest has been rediscovered and further developed. It is now the central “Innovationstag NEULAND” with a broader thematic spectrum. Participants have the possibility to get to know innovative ideas, technologies and start-up projects of students, scientific employees and professors. This year, already the 5th annual event took place.

Neuland-Foto 2017

 

 

 

 

 

Multi-chip transceiver module presented as a post-deadline paper at OFC 2017

March 23, 2017: Exploiting the photonic wire bonding technology, our research partners at KIT together with Vanguard Photonics have demonstrated an 8-channel silicon photonic transmitter module, operating at an overall line rate of 448 Gbit/s. The demonstration was reported as a post-deadline paper at the Optical Fiber Communications Conference 2017 in Los Angeles. OFC Post-Deadline papers represent the latest groundbreaking technical achievements in the field of optical communications, and only a few are selected by a panel of experts in a highly competitive process. OFC is the world’s leading global conference and exposition for optical communications.

Access to paper see here …